Samsung and SK Hynix Boost HBM R&D and Investment

By: rootdata|2026/08/02 07:46:02

Samsung Electronics and SK Hynix are accelerating their efforts in HBM and next-generation storage technologies. In the second quarter, Samsung Electronics' R&D investment reached a record 16 trillion won (approximately 11.6 billion USD), with plans to expand its lineup of high-end storage products such as HBM4, HBM4E, and DDR5. SK Hynix is developing next-generation technologies including HBM5, hybrid bonding, and iHBM, with capital expenditures expected to reach 40 trillion won (approximately 32.6 billion USD) this year.

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